Dicing Cassettes

Dicing Cassettes

Our goal is to achieve customers’ satisfaction by providing them with top quality and services that meet or exceed their expectation. It is our force to manufacture products to meet the exact requirement from our clients.

Applications

  • In-line Wafer Handling on Film Frame/Wafer Saw Frame
  • Wafer Dicing
  • Wafer Back grinding
  • Wafer/Die Sort
  • Wafer Mounting
  • Wafer/Die Pick & Place​

Surface Finish

  • Anodize Non-conductive
  • Hard Anodize Non-Conductive
  • Electroless Nickel Plating

Specifications

  • Standard dimensions in 4/5/6/8/12 inch
  • Material: Aluminum Alloy 6061T5, with Antistatic PC board
  • We provide Dust Covers, Handles, Locking Gates, and Custom Machining&Engraving for your options.

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